We provide a wide range of contract services for fine processing on wafers with reliable technology.
We offer contract processing related to wafer processing, from small-scale trial production and development to mass production. In-house processing includes film deposition (CVD, sputtering), photolithography, and etching, while other processing is done by partner companies. Film deposition involves forming insulating and metallic films of several hundred nanometers on the wafer. Photolithography transfers micron-scale patterns drawn on a mask onto the resist film on the wafer for patterning. Etching removes the formed films or materials like silicon through chemical reactions to create patterns. We also manufacture test and evaluation pattern wafers. We sell wafers with deposited films as well as bare wafers. Please feel free to contact us.
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For more details, please check our company website and product images. ■ CVD and Sputter Deposition CVD: Deposition of SiO2, SiN, SiON, a-Si films, etc. is possible. Sputter: Various metal films can be deposited. (Examples: Ti/Cu/Ni/Cr/Al/Ta/AlCu/NiCr/AlSiCu/Ta2O5, etc. Please consult us about films other than those listed above.) ■ Photolithography Resist film thickness: Positive resist = 0.4μm to 100μm Negative resist = 1.0μm to 500μm Minimum opening size: 0.6μm (varies with resist film thickness) ■ Etching Dry: Method RIE Film types: Si, quartz, Poly-Si, SiO2, SiN, SiON, a-Si, etc. Wet: Various acids and alkalis Chromium etching ITO film etching, other inquiries welcome Target substrates: Silicon, quartz (glass), sapphire, SiC, etc., We can also accommodate irregular substrates up to 8-inch wafers. Please feel free to contact us.
Price information
It may vary depending on specifications and quantities, so please feel free to contact us.
Delivery Time
※It varies depending on specifications and quantity, so please feel free to contact us.
Applications/Examples of results
Various semiconductor products/MEMS/advanced packaging/microchannel molds, etc.
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Company information
As a main business, we are engaged in the implementation and inspection of printer head substrates, as well as the appearance inspection, taping, and packaging of semiconductors. In recent years, we have expanded our operations to include wafer sales, wafer processing, special processing related to MEMS, manufacturing and sales of microfluidic chips, and contract services in the semiconductor front-end process. Additionally, we are involved in the design, assembly, and installation of factory automation equipment. - Wafer processing: Film deposition services (CVD, sputtering), patterning processing, etching processing. - Microfluidic chips: We assist in transitioning from custom-made chip development using our expertise in lithography technology with "PDMS" as the structural material for microchannels to mass production. - FA Division: We support everything from the conception, design, assembly, to installation of various automated machines. - Contract manufacturing: We deliver reliable products as a contract manufacturing partner for ODM and OEM. - Semiconductor assembly: We support everything from vision taping to appearance inspection.