Ultra-small size of 8 x 8 x 0.95 mm. Built-in antenna and clock. The module is designed to be pin-compatible with major standards. Radio wave certification obtained.
Insight SiP offers a variety of industry-leading smallest size modules that comply with the latest BT specifications, based on Nordic Semiconductor's high-performance BLE SoC. It supports BT5.0 Ready, BT5.0 Long Range, and BT5.1 AoA/AoD positioning functions, as well as BT5.2 LE Audio support. The modules integrate a 2.4GHz antenna for BLE communication, a balun matching circuit, and two crystal circuits within the same package, providing stable communication performance and minimizing the need for high-frequency design by the user. *For more details, please download the datasheet and other technical materials from our website or contact our sales representatives.*
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basic information
【Lineup】 ■ISP1507-AX nRF52832 based BT5.0 Ready 512kB Flash & 64kB RAM ■ISP1507-AL nRF52810 based BT5.0 Ready 192kB Flash & 24kB RAM ■ISP1507-AC nRF52805 based BT5.0 Ready 192kB Flash & 24kB RAM ■ISP1807-LR nRF52840 based BT5.0 Long Range 1MB & 256kB RAM ■ISP1907-HT nRF52833 based BT5.1 LR&AoA 512kB & 128kB RAM ■ISP1907-LL nRF52811 based BT5.1 LR&AoA 192kB Flash 24kB RAM ■ISP2053-AX nRF5340 based BT5.2 1MB & 512kB RAM *For more details, please download the PDF or contact us.*
Price information
Please contact our sales representative.
Delivery Time
P3
※The main products can be handled with the inventory of sales agents.
Applications/Examples of results
Beacon, indoor positioning, warehouse asset management, sensor-equipped devices, IoT terminals, LE audio, etc.
Company information
The French headquarters Insight SiP has been providing the industry's smallest class of wireless modules, equipped with patented technology and built-in compact antennas, for customers requiring essential solutions in the IoT field such as BLE, LPWA (LoRa, NB-IoT), ranging, UWB, and BT positioning communication for many years. The wireless modules on sale incorporate all necessary components for operation, including a wireless chip (SoC), crystal, and DC/DC converter, and operate simply by connecting to an external power source and sensor data. Combo modules like LoRa and UWB integrate multiple wireless chips and antennas, minimizing not only the need for high-frequency antenna design by customers but also reducing BOM and board space. Mass production is outsourced to local factories in Taiwan or the Philippines with proven track records. Development environments, including development kits and firmware for each product, are also provided, allowing developers to bring products to market in the shortest time without starting from scratch. The products obtain radio certifications from various countries and certifications from related organizations, facilitating the certification acquisition process for customers.
