Joining of dissimilar materials using CORE-X technology: A case study of Fe and Cu.
A new technology that strengthens the bonding between different materials and significantly reduces voids. Verification of dissimilar material joints using Fe and Cu!
At MOLE'S ACT Co., Ltd., we utilize atomic diffusion occurring between joining surfaces for 'diffusion bonding' and combine it with our new technology 'CORE-X technology' to achieve high strength at the joint when bonding dissimilar materials, significantly reducing voids. [Bonding of Dissimilar Materials with Fe and Cu] The photo at the top left of this page shows the bonding of Fe and Cu using our technology. The joining surfaces are closely adhered, demonstrating high strength. ◆ We are currently offering a document summarizing test results and technical data for various materials. Please view it via the "PDF Download" link below.
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We are engaged in the production and development of mold components that incorporate heat exchange channels into various molds using metal solid joining (diffusion bonding) technology. We also provide support for product development and technical development using diffusion bonding.