A new technology that strengthens the bonding between different materials and significantly reduces voids. Verification of dissimilar material joints using S45C + Cu!
At MOLE'S ACT Co., Ltd., we utilize atomic diffusion occurring between joining surfaces for "diffusion bonding," and by combining it with our new technology "CORE-X technology," we can achieve high strength at the joint when bonding dissimilar materials and significantly reduce voids. The photo at the top left of this page shows the bonding of S45C and Cu using our technology. The bonding surfaces are closely adhered, demonstrating high strength. ◆ We are currently offering a document summarizing test results and technical data for various materials. Please view it via the "PDF Download" link below.
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We are engaged in the production and development of mold components that incorporate heat exchange channels into various molds using metal solid joining (diffusion bonding) technology. We also provide support for product development and technical development using diffusion bonding.