Semiconductor Laser System【SMART-LAY】

Low heat input means it won't melt or warp! 1mm beam for detailed buildup! <Introducing 5 case studies!>

The semiconductor laser system 【SMART-LAY】 features semiconductor laser cladding that achieves characteristics impossible with conventional methods: low heat input that does not melt (low dilution), minimal distortion (low distortion), and the ability to build up details with a 1mm beam. Due to the low heat input, it reduces thermal distortion and heat-affected zones, allowing for thin build-up comparable to thermal spraying. <The catalog introduces five product examples! Please download from below.> <Comparison between conventional methods and semiconductor laser cladding> ■ Conventional methods Dilution rate: High welding heat (10,000°C) Build-up thickness: High amount of welding per hour Distortion amount: Significant thermal distortion due to high welding heat ■ Semiconductor laser cladding Dilution rate: Build-up with low heat input (2,500°C) Build-up thickness: Thin build-up comparable to thermal spraying (0.4mm) Distortion amount: Reduced thermal distortion and heat-affected zones due to low heat input <Example: Laser additive manufacturing cladding> *Excerpt from the catalog ■ Creating three-dimensional structures from powder through additive manufacturing cladding - No mold required for laser layering from powder ⇒ Reduced delivery time and costs - Rare metals can also be layered ⇒ Reduced base material and processing costs *For more details, please refer to the PDF document or feel free to contact us.

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