[Special Feature] Development of Thermal Viscoelastic Warping Analysis Technology for Multilayer Boards
At Mechanical Design Co., Ltd., which develops structural analysis and experimental measurement businesses, we publish "Mech D&A News" with the aim of introducing methods for applying structural analysis by selecting interesting problems from the field of practical design. In "vol.2010-3," we feature the development of thermal viscoelastic warping analysis technology for multilayer substrates. In addition to methods that consider the temperature dependence of the thermal expansion coefficient, we introduce the "Simple Evaluation Program for Thermal Warping of Viscoelastic Laminates," which allows for the instantaneous calculation of warping and stress by providing plate thickness and material constants. [Contents] ■ Simulation of substrate warping ■ Application of viscoelastic theory to plane stress fields and incremental methods ■ Extension of laminate theory to viscoelastic forms ■ Calculation examples and verification of the "Thermal Warping Analysis Program for Viscoelastic Laminates" ■ Summary *For more details, please refer to the PDF materials or feel free to contact us.
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Mechanical Design Co., Ltd. is engaged in structural analysis and experimental measurement businesses. We provide contracted CAE analysis, material measurement, and sales and maintenance of Abaqus and LS-DYNA. Additionally, we sell a rubber/viscoelastic material curve fitting program, as well as surface tension analysis programs using Abaqus and thermal warping analysis programs for viscoelastic laminated plates. Please feel free to consult us if you have any requests.