『Mech D&A News　vol.2012-3』

[Special Feature] Issues in Reliability Analysis of Semiconductor Packages with High Density and Composite Structures

At Mechanical Design Co., Ltd., which develops structural analysis and experimental measurement businesses, we publish "Mech D&A News" with the aim of selecting interesting problems from the field of practical design and introducing methods of applying structural analysis. In "vol.2012-3," we address various issues related to material and analysis models in the reliability analysis of semiconductor packages. Additionally, we include discussions on the utilization of large-scale analysis for solving these issues and future developments in large-scale analysis at the laboratory level, driven by advancements in computer technology. [Contents] ■ Introduction ■ Semiconductor Package Development and CAE ■ Structure and Materials of Semiconductor Packages ■ Anticipated Mechanical Issues and Material Constitutive Equations ■ Expectations for Large-Scale FEM ■ Conclusion *For more details, please refer to the PDF document or feel free to contact us.

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