[Special Feature] Issues in Reliability Analysis of Semiconductor Packages with High Density and Composite Structures
At Mechanical Design Co., Ltd., which develops structural analysis and experimental measurement businesses, we publish "Mech D&A News" with the aim of selecting interesting problems from the field of practical design and introducing methods of applying structural analysis. In "vol.2012-3," we address various issues related to material and analysis models in the reliability analysis of semiconductor packages. Additionally, we include discussions on the utilization of large-scale analysis for solving these issues and future developments in large-scale analysis at the laboratory level, driven by advancements in computer technology. [Contents] ■ Introduction ■ Semiconductor Package Development and CAE ■ Structure and Materials of Semiconductor Packages ■ Anticipated Mechanical Issues and Material Constitutive Equations ■ Expectations for Large-Scale FEM ■ Conclusion *For more details, please refer to the PDF document or feel free to contact us.
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Mechanical Design Co., Ltd. is engaged in structural analysis and experimental measurement businesses. We provide contracted CAE analysis, material measurement, and sales and maintenance of Abaqus and LS-DYNA. Additionally, we sell a rubber/viscoelastic material curve fitting program, as well as surface tension analysis programs using Abaqus and thermal warping analysis programs for viscoelastic laminated plates. Please feel free to consult us if you have any requests.