Processing of small aluminum parts. Achieving "fully automated and simultaneous processing of multiple pieces" through adhesive fixation.
At Meiwa's "Dedicated Double-Sided Tape Attachment and Fixing Processing," it is often judged that we excel in board processing, but we are also skilled in "thin and small aluminum parts." In general, fixing methods such as "clamping" and "pressing" increase the difficulty of processing thin items. With our processing technology, even small parts with a small attachment area can be securely fixed, ensuring they "do not move" or "peel off," allowing us to stably supply products with a processing precision of approximately 0.010 mm. Of course, we can also process multiple items simultaneously. *For more details, please refer to the PDF materials or feel free to contact us.*
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basic information
"Our Unique Pascal Processing Method" Generally, surface chamfering and edge finishing can be done from the surface, but with the Pascal processing method, we utilize the ease of processing the resin board on the machine table to complete the chamfering and deburring of the backside from the surface. *For more details, please refer to the PDF materials or feel free to contact us.*
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For more details, please refer to the PDF document or feel free to contact us.
Detailed information
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General Chamfering Process In a typical chamfering process, a chamfer cutter is used. When using clamps for chamfering, the clamps can get in the way, resulting in two additional steps for changing the clamps. Even with a five-axis machining center, chamfering on the backside of the material is not possible, so the material needs to be flipped over. This requires two additional steps on the backside, leading to a total of four steps, which incurs labor costs for the changeover work. Additionally, there are concerns about quality due to potential scratches or misalignment during the changeover, which involves human intervention.
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Meiwa's unique chamfering process (Pascal processing) 【What is Pascal processing?】 Our company's unique Pascal processing method uses a custom Pascal cutter, allowing for chamfering on both the front and back surfaces in a single step (this is limited to cases where only the back surface is being chamfered). Of course, since multiple pieces can be processed simultaneously from a single table, the workpiece changeover can be done all at once for many products. Everything is controlled by the machine's program in one step, ensuring stable quality supply.
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Company information
Our company conducts various experiments with double-sided tape and uses a solvent that allows for easy peeling, contributing to many fields through our bonding processing and easy peeling technology. We are confident that this technology offers significant benefits to our customers, especially for thin and small items. We perform high-precision processing with a processing range of 1,050mm x 560mm and a processing accuracy of around 10 microns. Please feel free to contact us.
![[Insulation Material Processing Example] Fineflex BIO Board Large Diameter Split](https://image.mono.ipros.com/public/product/image/2069787/IPROS9402177492004993539.png?w=280&h=280)