Diffusion bonding contributes to the high strength of dissimilar material joints and the reduction of voids.
Joining Dissimilar Materials: A Challenge for New Manufacturing
At MOLE'S ACT Co., Ltd., we utilize atomic diffusion occurring between joining surfaces for 'diffusion bonding' and combine it with our new technology 'CORE-X technology' to achieve high strength at the joint when bonding dissimilar materials, significantly reducing voids. 【Main Metal Materials】 ◯ Tungsten alloy ◯ Copper alloy ◯ Nickel alloy ◯ Stainless steel ◯ Pure titanium ◯ Carbon copper ◯ Porcelax, etc. ◎ For more details, please refer to the PDF materials or feel free to contact us.
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We are engaged in the production and development of mold components that incorporate heat exchange channels into various molds using metal solid joining (diffusion bonding) technology. We also provide support for product development and technical development using diffusion bonding.
