Small lot for development! For automotive and power supply use. Thick copper substrate (high current substrate).

With a maximum copper thickness of 400μm, it is suitable for heat dissipation measures and power supply for power devices! It can also be formed on substrates such as transformers and motors.

Meito Electric's "Thick Copper Substrate (High Current Substrate)" is suitable for heat dissipation and current supply in heating devices used in automotive and power supply applications. By increasing the conductor (copper) thickness compared to the conventional 35μm, power circuits and control circuits can be formed on the same substrate. The creation of thick copper coil patterns allows for the construction of transformer circuits and motor circuits on the substrate. 【Substrate Specifications】 ■ Outer layer copper foil thickness: 70μm to 200μm ■ Inner layer copper foil thickness: 70μm to 400μm ■ High thermal conductivity resin: up to 8W/mK ■ Bonding: High thermal conductivity resin and copper, etc. ■ Number of layers: Proven from 2 layers to 10 layers (specifications to be discussed) ■ Copper plate: C1020 (oxygen-free) or C1100 (tough pitch) *For detailed information, please download the PDF or feel free to contact us.

Contract manufacturing