As an inspection of the front-end process of power semiconductors, applying uniformly at multiple points on the wafer surface reduces the burden on the semiconductor.
This is a probe developed with innovative technology, featuring excellent characteristics. We have developed a multi-point laminated probe specifically for power semiconductors, applying the characteristics of a laminated structure consisting of metal plates (probes) and insulators. 【Features】 - The probe tip is shaped like a wave, allowing contact with the semiconductor at multiple points. This disperses the amount of current and voltage applied, reducing the burden on the semiconductor. - It can move vertically by about 1 millimeter, minimizing contact marks. - Its compact design makes it easy to secure installation space. *For more details, please download the PDF or contact us.
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Inks Co., Ltd. provides precision probes, precision parts, and precision models (such as desktopZERO). In the probe business, we achieve high performance with innovative technology, including spring probes, high-frequency probes, and stacked probes. To pursue high performance, we do not use automated machines and manufacture our products by hand. In addition, in the product business, we incorporate the foundational press technology with the experience, knowledge, and know-how cultivated in the consumer business to solve our customers' problems.