Suppress fatigue, deformation, and damage to the substrate caused by vibrations! We also accept custom specifications for products.
The "Dampers for Circuit Board Vibration Countermeasures (PID)" is a new product from Topline, a company in the United States. This technology was developed by NASA and has obtained U.S. Patent US 9521753 B1. By using this product, fatigue, deformation, and damage to the circuit board caused by vibrations are suppressed. Tungsten balls filled in an FR4 or aluminum casing (with a case volume ratio of 90%) collide violently within the case, providing a damping effect against random vibrations in the fundamental frequency range. We offer tungsten balls of varying diameters and various sizes. Custom specifications are also available. 【Features】 ■ Obtained U.S. Patent US 9521753 B1 ■ Suppresses fatigue, deformation, and damage to circuit boards caused by vibrations ■ Damps oscillations against random vibrations in the fundamental frequency range *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
【Lineup】 ■ FA Series ■ FL Series ■ FB Series ■ FP Series ■ FS Series ■ K Series *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
Company information
We will quickly provide all materials and products related to the packaging of semiconductors and electronic components.