Processing and polishing of printed circuit boards.

It has an astonishing grinding power compared to conventional non-woven fabric rolls in printed circuit board polishing.

Ceramic rolls are the latest polishing material that far surpasses the grinding power and precision grinding surface of the non-woven fabric rolls traditionally used for printed circuit board polishing. They are currently utilized not only for printed circuit board polishing but also in various other fields. They polish large protrusions and hard inks with a powerful grinding force that conventional rolls do not possess. There is absolutely no hole bleeding regardless of the size of the holes, and the ink surface finishes flat. They are also effective for polishing metal pastes. 【Features】 - Deburring polishing after drilling - Removal of roughness after plating and leveling - Removal of prepreg resin after IVH board pressing - Leveling of resin in build-up resin boards and resin-coated boards - Leveling of plating height for active boards and plated bumps There is no copper dragging due to polishing, enabling the formation of fine line patterns. *For more details, please download the PDF or feel free to contact us.

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