Printed Circuit Board Manufacturing Process

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last updated：Jul 17, 2018

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We manufacture printed circuit boards using in-house developed equipment created from the production site.

We would like to introduce the "Printed Circuit Board Manufacturing Process" of Minami Electronics Industry Co., Ltd. We manufacture printed circuit boards using our self-developed equipment born from the production site. The processed items include various types of printed distribution boards, various resin boards, and light metal processing. Major equipment includes CAM editing machines, laser photoplotters, rotary fixed-length cutting machines, manual and automatic presses, acid cleaning and water cleaning machines, and flying electric inspection machines. 【Printing Line Process】 ■ Circuit Printing: Buff polishing, dry film lamination, exposure, development, and etching ■ Processing Inspection ■ Scientific Grinding ■ P.S.R Printing: Resist printing and exposure ■ Thermal Curing ■ Component Diagram Printing: Component diagram printing and thermal curing UV curing *For more details, please refer to the PDF materials or feel free to contact us.

Related Link - http://www.mdk-j.com/index.html

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【Features】 ■ Cutting: In-house developed automatic rotary cutting machine ■ Milling: In-house developed end face polishing machine, high-precision router processing ■ Drilling: Minimum drill for through holes 0.1mm (board thickness 0.1t to 0.4t) 0.15mm (board thickness 0.1t to 1.2t) ■ Punching: Industry-first high-performance micro press, high-speed automatic press device, vertical precision 8μm ■ Exposing: Manual exposure machine (exposure precision within 50μm) Automatic exposure machine (exposure precision within 20μm) 【Overview of Our Printed Circuit Board Manufacturing Process (Partial)】 <Headquarters> ■ Substrate cutting and hole drilling ■ Peripheral processing ・Achieving low costs with in-house equipment ■ Through hole processing ・0.1mm (board thickness 0.1t to 0.4t) ・0.15mm (board thickness 0.1t to 1.2t) <Headquarters Factory Circuit Printing Manufacturing> ■ Exterior lamination ・Dedicated for fine line patterns ・Using dry film ■ Pattern exposure etching ・Average exposure for fine line patterns: L/S100μm ・Automatic diffusion exposure for fine line patterns: L/S120μm *For more details, please refer to the PDF document or feel free to contact us.