Just press the button! An automatic gel time measurement device that doesn't require skilled techniques.
"MADOKA" can easily and automatically measure the gel time of thermosetting resins, two-component curing resins, and room temperature curing resins. It enables the acquisition of high-precision and stable data regardless of the skill level of the measurer. It allows for database management of measurement results and data analysis. Quality control for each type of resin is also possible using Statistical Process Control (SPC) and Statistical Quality Control (SQC). 【Features】 ■ Achieves a two-axis eccentric stirring method to obtain data correlated with JIS and IPC manual methods ■ Measurement results can be used for product quality control and data analysis ■ Heater temperature settings, stepwise heating functions, stirring rotation speeds, and more can be freely adjusted ■ High-speed temperature control allows the heating plate to reach the set temperature in about 3 minutes *For more details, please refer to the catalog. Feel free to contact us with any inquiries.
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【Exhibition Participation Information】 ★ 2018 Yokohama International Automobile Technology Exhibition ・Dates: May 23 (Wed) - 25 (Fri), 2018 10:00 AM - 6:00 PM *Until 5:00 PM on the last day ・Venue: Pacifico Yokohama Exhibition Hall ・Booth: No. 22 ★ JPCA Show 2018 (48th International Electronic Circuit Industry Exhibition) ・Dates: June 6 (Wed) - 8 (Fri), 2018 10:00 AM - 5:00 PM ・Venue: Tokyo Big Sight, East Hall 7 ・Booth: No. 7C-23 *We sincerely look forward to your visit! 《Available Materials》 Epoxy Mold Compound (EMC), Prepreg for Printed Circuit Boards, Epoxy Resin, Phenolic Resin, Silicone Resin, Polyurethane, Urea Resin (Urea Resin), Melamine Resin, Diallyl Phthalate Resin, Silicone Resin, Vinyl Ester Resin, Unsaturated Polyester Resin (SMC/BMC), Polyimide, etc. *For more details, please refer to the catalog. Feel free to contact us with any inquiries.
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Measurement of gelation time for epoxy mold compounds (EMC), prepreg for printed circuit boards, epoxy resin, phenolic resin, silicone resin, polyurethane urea resin (urea resin), melamine resin, diallyl phthalate resin, silicone resin, vinyl ester resin, unsaturated polyester resin (SMC/BMC), polyimide, etc.
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We are also working on medical-related control devices based on software development. We have achievements at institutions such as the National Institute of Radiological Sciences.