High-Temperature Resistant Adhesive Transfer Tape (for Lead-Free Solder Reflow)

Low adhesive application of the adhesive material, excellent processability! Adhesive transfer tape that withstands high temperatures.

This product is an adhesive transfer tape that withstands high temperatures (260°C) in lead-free solder reflow processes. After passing through the lead-free solder reflow, the degradation of the release paper is minimal, and the reduction in adhesive strength is significantly lower compared to conventional tapes. Additionally, it has excellent heat retention properties, resulting in less shifting at high temperatures, and due to the substrate, there is less adhesive bleed, making it easy to process. It is suitable for adhesive applications in FPC (Flexible Printed Circuit). 【Features】 - Minimal degradation of the release paper after passing through lead-free solder reflow, allowing for easy release. - The reduction in adhesive strength after passing through lead-free solder reflow is smaller than that of conventional tapes. - Excellent heat retention properties, resulting in less shifting at high temperatures. - Less adhesive bleed due to the substrate, providing excellent processability. - Low outgassing, minimizing the impact on electronic components and other materials. *For more details, please refer to the PDF document or feel free to contact us.

Adhesive tape