Achieving a 40% reduction in thickness! Introducing a flexible, low-rebound, and excellent multilayer flexible substrate.
The "Ultra-thin Flexible Multi-layer FPC" is a multi-layer flexible substrate that achieves a thinner profile while maintaining the same wiring density as standard multi-layer FPCs. It enables bending wiring in narrow spaces, which was previously difficult, contributing to the ongoing lightweight and compact development of digital electronic devices. It can be applied to wearable devices used in various fields, including mobile devices, medical and nursing care, robotics, sports, and healthcare. 【Features】 ■ Achieves a 40% reduction in thickness ■ Uses polyimide as the substrate, ensuring sufficient reliability while being thin ■ Excellent embedability due to its thin, flexible, and low-rebound characteristics *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Product Specifications】 ■Structure (Number of Layers): Multi-layer (3 layers, 4 layers) ■Thickness: 4 layers 0.2–0.26mm 【Examples of Characteristics】 1. Connection Reliability - Content: Temperature Cycle - Conditions: -65℃⇔125℃ 1,000 cycles - Characteristics: No abnormalities 2. Interlayer Insulation - Content: Constant Temperature and Humidity Bias - Conditions: 85℃ 85% RH 1,000H - Characteristics: ≧100MΩ 3. Bend Resistance - Content: Mandrel Test - Conditions: R1.0mm 180° bend - Characteristics: ≧300 times *For more details, please refer to the PDF document or feel free to contact us.
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【Usage】 ■Can be used for measuring instruments, control mechanisms, and other applications requiring high functionality and high-density wiring. *For more details, please refer to the PDF document or feel free to contact us.*
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Company information
Okiden Wire engages in a consistent business operation that encompasses everything from development and design to manufacturing and sales, focusing on a range of products such as wires for equipment, communication cables, electrode wires for wire-cut electric discharge machining, and flexible printed circuits (FPC).