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  6. Introduction to SMT-B Line for Surface Mount Printed Circuit Boards: Compatible with L Size

Introduction to SMT-B Line for Surface Mount Printed Circuit Boards: Compatible with L Size

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last updated:Oct 06, 2023

浜松パルス 都田工場
浜松パルス 都田工場
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Implementation of L-size substrates is possible!! Here is a list of equipment specifications and facilities for the surface mount technology (SMT-B line) process of printed circuit boards.

We handle everything from small lot multi-variety printed circuit board assembly for L-size substrates to the assembly and packaging of finished products, and we have established a system that allows us to provide products consistently, primarily through production outsourcing. ◆ Line Name: Surface Mount: SMT-B Line ◆ Target Substrate Dimensions: 50(W)×50(L) to 390–460mm ◆ Target Component Dimensions: 0402 to 120×90mm, minimum 0.4mm pitch ◆ Target Component Height: up to 28mm ◆ Target Component Variety: 280 varieties (equivalent to 8mm tape) 【Equipment】 Printer: SPG2 (Panasonic) with 2D solder inspection + coating function Mounting Machine: AM100 (Panasonic) Mounting Machine: AM100 (Panasonic) with tray changer N2 Compatible Reflow Oven: TNV-N568CR-P (Tamura Manufacturing) *For details, please download and view the materials.

    Contract manufacturing
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Introduction to SMT-B Line for Surface Mount Printed Circuit Boards: Compatible with L Size

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Hamamatsu Pulse Co., Ltd. Company Profile

Hamamatsu Pulse Co., Ltd. Company Profile

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浜松パルス

浜松パルス 都田工場

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Since our establishment, we have consistently adhered to the theme of "creating products that provide satisfaction to users," and our motto has been to contribute to manufacturing from the customer's perspective. We have cultivated our production technology as a manufacturing contractor based on the strong trust and achievements from major manufacturers, ranging from printed circuit board assembly to semi-finished module assembly, and to the assembly and packaging of finished products. Our company and employees work together to continuously challenge ourselves to create "higher satisfaction through manufacturing" and to respond swiftly to needs. We handle everything from small-lot, diverse printed circuit board assembly to the assembly and packaging of finished products, and we have established a system that allows us to provide products consistently, focusing on production outsourcing. We actively accept contracts for semi-finished module assembly and finished product assembly, regardless of whether circuit board assembly is involved, so please feel free to contact us. *Please consult us regarding prototype-only or limited-time cases.

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