We accept wafers of all sizes! Leave the plating processing service to us!
At Assist Navi, we offer "Wafer Level Various Plating Contract Processing Services." Please leave the processing of "Rewiring Formation and BUMP Processing," "TSV (through-silicon via) Processing," and "Electroless Plating (UBM Plating)" to us. 【Rewiring Formation and BUMP Processing】 <Main Processing Services> ■ Cu Plating Rewiring Processing (Line & Space 10μm/10μm) ■ BUMP Processing: Cu, Ni, Au, Solder (Sn-Ag, Sn-Ag-Cu) Low Melting Point Solder, etc. ■ N Electroforming *For more details, please refer to the PDF document or feel free to contact us.
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【TSV (Through-Silicon Via) Processing】 <Main Processing Services> ■ C embedded plating for Si through electrodes ■ Hole diameter: 30–100μmφ ■ Depth: Aspect ratio 10 *Varies with hole diameter. ■ Series of processes: Si deep etching → Seed film deposition → Cu embedded plating ■ TEC Wafer for SE deep etching products 【Electroless Plating (UBM Plating)】 <Main Processing Services> ■ Various electroless plating (Ni, Pd, Au, etc.) ■ Compatible with various plating baths (cyanide, non-cyanide/replacement, reduction) *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Assist Navi prioritizes customer requests above all, striving to provide satisfactory products and services with a motto of speedy response and a spirit of challenge. We aim to maintain a flexible system and innovative thinking to adapt to market changes at all times.