Suitable for aerospace equipment and artificial satellite components! Proven performance in ultra-low temperature environments!
This product is an epoxy-based adhesive that has a proven track record in ultra-low temperature environments cooled by liquid helium (-269°C). It is characterized by its resistance to cracking even in ultra-low temperature environments and its strong adhesive strength. We offer a lineup of "optical adhesives" suitable for potting, protective applications, and structural bonding applications, as well as "conductive adhesives" and "insulating thermal conductive adhesives." 【Features】 ■ Resistant to cracking even in ultra-low temperature environments ■ Low outgassing (products compliant with NASA ASTM E595 available) ■ High adhesive strength ■ Proven track record in ultra-low temperature environments cooled by liquid helium (-269°C) ☆==========================================================☆ In addition to adhesive sales, Rikei can consistently propose solutions from fiber customization to termination processing, arraying, bundling, and high-power connector assembly. If you have any issues related to optical fibers, please feel free to contact us. ☆==========================================================☆
Inquire About This Product
basic information
【Lineup】 ■ Optical Adhesives ■ Conductive Adhesives ■ Insulating Thermal Dissipating Adhesives * You can download the English version of the catalog. * For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
【Applications】 ■ Aerospace equipment ■ Artificial satellite components ■ Scanning Electron Microscope (SEM) * You can download the English version of the catalog. * For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
Rikei Corporation was established in 1957 and is a solution vendor in the IT and electronics industry, celebrating its 65th anniversary. We propose a variety of solutions centered around cutting-edge technologies and advanced products in the fields of system solutions, network solutions, and electronic components and devices, tailored as the optimal "step-ahead solution" to meet our customers' needs.
![One-component heat-releasing epoxy adhesive [developed product]](https://image.mono.ipros.com/public/product/image/03b/2000853160/IPROS12289008076012958777.jpeg?w=280&h=280)
