We offer various dicing processes, including difficult-to-dice materials, fine groove processing, and cubic capabilities.
"Dicing processing" is a method of cutting substrates into a grid pattern using a diamond blade. Our company is capable of processing substrates such as semiconductor wafers, optical glass components, and ceramics to sizes of 0.5mm and above. We will set conditions according to the specifications of the products you require. Dicing tape is advantageous in terms of cost. Cutting with wax and other materials is effective for pursuing dimensional accuracy and dicing irregularly shaped substrates. Please feel free to contact us with your requests. 【Product Lineup】 ■ Glass Dicing ■ Ceramic Dicing ■ Thick/Composite Material Laminate Wafer Dicing ■ Crystal Dicing *For more details, please download the PDF or feel free to contact us.
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【Material】 ■Difficult-to-cut materials ・SiC ・Silicon ■Grooving processing ・Silicon ・Ceramic ・Zirconia ・Quartz *For more details, please download the PDF or feel free to contact us.
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Tama Electronics Co., Ltd. has been continuing its business for about 40 years since its establishment, primarily focusing on contract processing of semiconductor assembly in the Tama region. Based on our key technology of dicing processing, we ventured into contract processing of optical components in the 2000s, transforming into a contract manufacturer handling components from electronics to opto-devices. Since 2014, we have also succeeded in developing the world's thinnest IR cut filter as our own product, and we continue to expand our business as a manufacturer of electronics and optical components, not only through contract processing but also by offering our own products. Please feel free to contact us if you have any inquiries.