Reduction of plating labor! Reduction of discarded plated pins generated by integrated molding! Suppression of solder wicking! Expecting cost reduction and shorter delivery times! Numerous delivery achievements!
Our company offers "hoop plating" for products after "pressing ⇒ resin molding." *Patent obtained. It is also possible to perform plating on a pair of terminals insulated by molded resin, which can reduce the plating process time. Additionally, the number of waste pins after plating is reduced. Plating is performed on areas not in contact with the resin due to resin molding, which helps suppress solder wicking. (Areas in contact with the resin are not plated.) 【Features】 ■ Plating possible on a pair of insulated terminals ■ Reduction of plating process time ■ Reduction of waste pins after plating ■ Solder wicking suppression effect ■ Continuous hoop plating possible after integrated molding ■ Compatible with Au plating, Ag plating, matte Sn plating, and glossy SnCu plating *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
【Processing Specifications】 ■Plating Specifications ・Ni base Au plating ・Ni base Sn/Sn-Cu plating ■Material: Cu alloys, etc. ■Resin: LCP, etc. *For products outside the specifications above, please contact us separately. *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
【Usage】 ■ Plated products after "press ⇒ resin molding" *For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
"I want to increase conductivity," "I want to improve glossiness," "I want to make it rust-resistant," "I want to make it harder," "I want to improve slip resistance"... The functions and applications required for surface treatment technology are indeed diverse. For example, the "nickel barrier" for mobile phone connectors is one of the technologies we have established in response to our customers' requests. We sincerely address each of these customer needs and respond with the experience and know-how we have cultivated over many years. Additionally, we have pioneered lead-free plating technology that does not burden the environment. In our tin hoop plating line, we have integrated "reflow" inline, enabling a consistent production process from plating to reflow. Furthermore, to deliver our surface treatment technology to more customers, we are actively working on expanding our business locations. In addition to our two domestic locations (Toyama Factory (headquarters) and Tokyo Sales Office), we have also established a local subsidiary in Mexico, creating a system to deliver our surface treatment technology with high quality and speed. Takamatsu Plating is engaged in outstanding electroplating processing that adds various functions to a wide range of materials.