It can be done with standard monochrome molded products, and the finish can take advantage of the dimensional accuracy of the molded products!
The special masking liquid jointly developed with our paint manufacturer can be removed during the pretreatment stage of the plating process. As a result, it is possible to partially plate while leaving the texture of the base material intact. 【Features】 <Partial plating using the TP Mask method> ■ The finish can take advantage of the dimensional accuracy of the molded product. ■ Partial plating, which was previously done on two-color molded products, can now be performed on standard single-color molded products. *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
catalog(1)
Download All CatalogsCompany information
Our company's feature is electroplating on plastic. Since successfully industrializing in 1963, we have been experimenting with the coexistence of industry and the natural environment. If the 20th century was a century that emphasized productivity, sometimes at the cost of destruction, then the 21st century should prioritize new creation and better coexistence with nature. Our company has quickly taken on the mission of recycling plated products, establishing technology to separate and recover raw materials and plating components from previously discarded disposal methods, and is now actively recycling plastic plated parts and printed circuit boards as valuable resources. The global perspective on nature conservation is a common viewpoint for all people involved in industry. Through our business in surface treatment processing, we are now sincerely committed to nature conservation. Tsukada Riken Kogyo Co., Ltd. continues to uphold its pride as a top manufacturer in surface treatment processing, centered on two pillars: plastic plating and Ni-Au plating for printed circuit boards, aiming for further leaps forward.