[Free comprehensive catalog available!] Board-to-board (FPC) connectors
P/N 20842-0**E-21 (Plug) / 20843-0**E-21 (Receptacle)
The substrate-to-substrate (FPC) connector with a mating height of 1.5 mm has achieved high retention force and a clear click feel through dedicated design.
The design incorporates a metal hold-down to enhance the rigidity of the connector while also featuring a mechanism to prevent partial mating. Additionally, wiring space has been secured at the bottom of the connector, increasing the flexibility of circuit design. The product is designed to allow visual confirmation of the mating state (when the receptacle is mounted on the FPC).
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basic information
Pitch: 0.35 mm Height: 1.5 mm (max. 1.56 mm) Width: 2.66 + (0.35 * number of pins / 2) mm Depth: 2.8 mm Number of pins variation: 10 - 50 Please check the "lineup" for the number of pins and product numbers. Rated current: 0.3 A/pin (Signal pin) 3.0 A/pin x2 (power pin)
Price range
Delivery Time
Applications/Examples of results
Small electronic devices such as notebook PCs, digital cameras, and smartphones.
Detailed information
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Visual confirmation of the fitting state When the receptacle is implemented on the FPC, the fitting state with the plug can be confirmed through a small window.
Line up（4）
| Model number | overview |
|---|---|
| 20842-010E-21 / 20843-010E-21 | |
| 20842-030E-21 / 20843-030E-21 | |
| 20842-040E-21 / 20843-040E-21 | |
| 20842-050E-21 / 20843-050E-21 |
catalog（1）
Download All Catalogs
I-PEX Board-to-Board (FPC) Connector Comprehensive Catalog
Company information
I-PEX is a "manufacturing solution expert" that provides value in the form of inspiration and surprise in the global market. Founded in 1963 as "Daiichi Seiko," a precision mold manufacturer in Kyoto, I-PEX has engaged in challenging manufacturing through the refinement of technology centered on in-house production of molds and manufacturing equipment, creating numerous world-first and unique products and solutions. I-PEX develops, manufactures, and sells connectors, sensors, semiconductor manufacturing equipment, and also undertakes contract manufacturing of automotive parts, precision molded products, and various manufacturing equipment to supply to the market. The image of the company building is the exterior of the headquarters located in Kyoto.
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