Strengths are "floating, tilting, and foreign objects"! Introducing the 3D image inspection equipment we have implemented.
The "Ky Technical Report" is a technical document that publishes technical information and special responses related to the manufacturing operations conducted by K-Y Electronics. In issue No. 025, we introduce the '3D Image Inspection Device' that was introduced in 2017. Our company previously conducted 100% inspection after the SMT process using a 2D image inspection machine (Omron RNS-VT-L). While the detection capability for un-soldered joints is very high with this equipment, it is a testing method that struggles to detect issues such as components/leads lifting or misalignment, which is why we introduced a 3D inspection device. Defects such as "the joint is made, but the lead is lifted, resulting in insufficient strength" can now be detected through our inspections. [Strengths] ■ Lifting ■ Tilt ■ Foreign matter ■ Solder height *Conditions apply *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
【Equipment Overview】 ■ YAMAHA Corporation 3D Function Equipped Image Inspection YSI-V-typeHS ■ Board Size: 610×560 ■ Supports minimum components 0402 ■ Reproduces the concept of height using a 4 aromatic projector, adapted for inspection logic ■ Supports measurement with lasers ■ Capable of comprehensive foreign object inspection ■ Conducts 2D inspection + measures component/solder height for pass/fail judgment ■ Capable of foreign object inspection across the entire board outside the inspection frame *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs![[Ky Technical Report] Regarding 3D Image Inspection](https://image.mono.ipros.com/public/catalog/image_generated/01/1ce/441108/20181119151016_IPROS8505992678098983229_1.jpg?w=120&h=170)
Company information
Our company is engaged in assembly operations in Osaka. Although we are a small town factory, we can produce everything from SMT assembly to unit assembly. In particular, we are capable of high-density and narrow-pitch CSP assembly. We can also inspect BGA and other components using X-ray inspection equipment. Most of our orders are for small lot items (around 50 to 1,000 units), so we do not seek large lot orders (such as tens of thousands of units). Because we focus on small quantities, we have abandoned the idea of reducing defects at each process and repairing finished products later. Instead, we prioritize high-quality production by carefully selecting solder based on the opening and difficulty of each component during mask creation. Please take a look at our website for an overview of our company and detailed equipment information.
