Basic Knowledge of Circuit Board Assembly: The Principle of Solder Bonding to the Circuit Board Surface
Presenting technical information: Explanation of the principle of solder bonding to the surface of the circuit board.
"Ky Technical Report" is a technical document that includes technical information and special responses related to the manufacturing operations conducted at K-Y Electronics. Issue No. 027 introduces the "Principle of Solder Bonding to PCB Surfaces." There are generally three types of land formation on PCBs: - Copper (Cu) plating (preflux) - Solder plating on copper (Cu) - Copper (Cu) → Nickel (Ni) → Gold (Au) plating This document specifically explains the basic three types in relation to PBF and SMT. [Contents] - Cross-section of soldered components - Image of Cu (copper preflux) - Summary *For more details, please refer to the PDF document or feel free to contact us.
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Our company is engaged in assembly operations in Osaka. Although we are a small town factory, we can produce everything from SMT assembly to unit assembly. In particular, we are capable of high-density and narrow-pitch CSP assembly. We can also inspect BGA and other components using X-ray inspection equipment. Most of our orders are for small lot items (around 50 to 1,000 units), so we do not seek large lot orders (such as tens of thousands of units). Because we focus on small quantities, we have abandoned the idea of reducing defects at each process and repairing finished products later. Instead, we prioritize high-quality production by carefully selecting solder based on the opening and difficulty of each component during mask creation. Please take a look at our website for an overview of our company and detailed equipment information.