Oxidation can be suppressed, and the metallic luster of the molten solder surface can be maintained!
The "LFM-H Series" is a solder containing antioxidants that achieves "reduction of oxidation dross on the surface of molten solder" and "reduction of solder ball scattering" due to the effects of the antioxidants. We offer a lineup of SAC305, Sn-Cu-based, and copper erosion-resistant alloys. Please feel free to contact us if you have any requests. 【Features】 ■Significantly suppresses the generation of oxidation dross ■Reduces the occurrence of solder balls during dipping *For more details, please download the PDF or feel free to contact us.
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【Lineup】 ■SAC305 ・LFM-48H ■Sn-Cu System ・LFM-22H ■Copper Erosion Resistant Alloys ・LFM-41H ・LFM-59H ・LFM-62H *For more details, please download the PDF or feel free to contact us.
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Japan Almit Co., Ltd. is constantly improving its response and organizational structure to ensure sincere communication with customers not only in Japan but also around the world. We are committed to enhancing quality and developing a sales information system, focusing on meticulous responses and services. Moving forward, as a company with a global vision that harmonizes with the Earth's environment and connects joy to the next generation, we will actively set high goals for coexistence with the planet and work towards the development of society and the dissemination of technology for the future.