Arrow Industries for special substrates (metal substrates, heat dissipation substrates, UV protection substrates)
Introduction of high-power modules, heat dissipation measures for UV-LEDs, and UV protection substrates for UV-LEDs.
<Heat Dissipation Measures with Special Substrates> - Metal (Copper/Aluminum) Bump Substrate A substrate that utilizes the metal bump areas, which remain after etching a copper plate, for heat dissipation. The structure connects heat sinks of UV-LEDs, high-brightness LEDs, and high-power semiconductors directly to the metal bump areas, allowing heat to escape efficiently. - Water-Cooled Flow Path Circuit Substrate A high heat dissipation substrate that integrates a water-cooled heat sink directly onto a metal base substrate. This is effective in situations where standard heat sinks are insufficient for heat dissipation, or for devices like UV-LEDs that have poor conversion efficiency and require essential thermal management. <UV Protection Substrates for UV-LEDs> - Hybrid Substrate A hybrid substrate developed to prevent degradation of connectors due to ultraviolet light, combining a copper base substrate with a glass-epoxy substrate. By partially forming through-holes, it allows for component mounting, such as connectors, on the back side while still being a metal base substrate, thus preventing degradation of components from ultraviolet light. - Inorganic Resist Coated Substrate An inorganic resist coated substrate that maintains high reflectivity even in the UV-C range, designed for long-term reliability. It is applied to the substrate as a measure against degradation from UV light and as a high-reflectivity material.
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basic information
From as few as 1 piece～ We accommodate small lots, prototypes, and mass production. <Heat dissipation measures with special substrates> - Metal (copper, aluminum) bump substrates - Water-cooled flow circuit substrates <Heat measures with high thermal conductivity insulation layers> - Various insulation sheets for heat dissipation measures (1W/m·k to 10W/m·k) <UV countermeasure substrates for UV-LEDs> - Hybrid substrates - Inorganic resist-coated substrates *We also accept commonly used glass epoxy substrates.
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Applications/Examples of results
<Heat Dissipation Measures> - Metal (Copper/Aluminum) Bump Substrate Application: High-power LED modules, effective use of heat dissipation pads (neutral poles), etc. - Water-cooled Flow Circuit Substrate Application: UV irradiators, etc. <UV Countermeasure Substrates> - Hybrid Substrate Application: Exposure UV-LED modules, lighting UV-LED modules - Inorganic Resist Coated Substrate Application: Medical use, water sterilization, air purification, printing applications, etc.
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Company information
If you need UV LEDs or high-brightness LED substrates, trust Arrow Industries! - We welcome inquiries about substrates from the development stage! - We can handle prototype and small lot production of special substrates! - For heat dissipation substrates (thick copper, aluminum/copper base, copper bumps, etc.), come to Arrow Industries; we can also handle assembly. - Research and development of high-reflective resist coatings to prevent degradation from ultraviolet light. Over 20 years of experience in the design and manufacturing of special substrates and heat dissipation substrates. We provide a consistent service from printed circuit board design and manufacturing to component assembly. We flexibly accommodate prototype boards and a variety of small lots, so please feel free to request materials or inquire for quotes.