Leave ceramic processing and machining processing to us!
Our company conducts precision machining from metal precision cutting to ceramic precision grinding. We respond to customer requests with precision grinding of ceramics using surface grinding machines and machining centers, as well as precision cutting of metals and non-ferrous metals. 【Production Equipment】 ■Machining Center (1) Mazak NEXUS510C x 1 ■Machining Center (2) Brother TC-S2C x 1 ■Software, etc. *For more details, please download the PDF or feel free to contact us.
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【Product Line】 ■ Ceramic Processing (Material: Alumina 99.5%) - LCD device components - Semiconductor device components - Multi-layer laminated substrate hole processing - Mechanical parts ■ Machining (Material: Steel, Stainless Steel, Aluminum, Brass, Resin, etc.) - Mold plates - Mechanical parts - LCD device components - Semiconductor device components *For more details, please download the PDF or feel free to contact us.
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TH Seiko conducts precision grinding of ceramics using surface grinding machines and machining centers, as well as precision cutting of metals and non-ferrous metals. We can accommodate from a single piece. We are also available on weekends and holidays. Please feel free to contact us with your requests.