Widely applicable for solving the challenges of soldering and welding! Compatible with various coating methods and materials.
"Dotaite Adhesive Type" is a high-performance conductive adhesive developed for the microelectronics field. It can be widely used to solve the challenges of conductive adhesion for materials that do not have high-temperature resistance, as well as issues related to soldering and welding. We offer a lineup of products characterized by conductivity, adhesive strength, heat resistance, flexibility, and workability, with a diverse range of variations tailored to applications and methods, including solvent/solvent-free options, curing conditions, and viscosity. 【Product Lineup】 ■FA-705BN ■XA-874 ■XA-910 ■XA-5617 ■AA07, etc. *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Characteristics】 ◎Product Name: FA-705BN ■Conductivity: 6×10^-4 Ω·cm ■Adhesive Strength: 8 N/mm² ■Thermal Decomposition Temperature: 250 ℃ ■Young's Modulus: 5 GPa ■Conditions: 150℃ 30min ■Storage Conditions: Refrigerated ■Diluent: Solvent-free ■Applicable Methods: Screen printing, Dispensing ■Features: Wide range of applications, good contact resistance *For more details, please refer to the PDF document or feel free to contact us.*
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For more details, please refer to the PDF document or feel free to contact us.
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Fujikemi Kinki Co., Ltd. is a subsidiary of Fujikura Kasei Co., Ltd. and is engaged in the construction and chemical products businesses. In the chemical products business, we respond to diverse needs centered around three main areas: coating products, electronic materials products, and chemical products. Please feel free to contact us if you have any inquiries.