Soldering defects: Flux scattering, solder balls (solder with resin)

We will introduce knowledge and techniques related to soldering defects, such as the causes of flux scattering.

One of the common issues during work with rosin-containing solder is flux scattering. In addition to damaging the appearance of the product, flux that adheres to the LCD screen, camera unit, and switch contacts can lead to product malfunctions. Flux scattering occurs when low-boiling and low-decomposition components in the flux boil and gasify due to the heat during soldering, resulting in an explosion simultaneous with solder melting. Factors that make scattering more likely include: - Not selecting solder appropriate for the task. - The soldering iron temperature being too high. - The speed of solder feeding being too fast. - The working location being at a high altitude (low surrounding air pressure). Solder balls are also likely to occur simultaneously with flux scattering. They can arise when solder is fed too rapidly, as well as when the movement of the soldering iron is too vigorous or when there is too much solder. Measures such as increasing the melting viscosity of the flux and using materials with less gasification can help reduce scattering caused by solder materials. Our company offers rosin-containing solder and solder paste with scattering countermeasures. For samples, please contact us through our website below.

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