It is a special heat dissipation material that shows superior heat dissipation effects compared to acrylic-based materials, and the volatile substances due to heating are extremely low compared to acrylic-based materials.
◆This is a special heat dissipation material that shows superior heat dissipation effects compared to acrylic-based materials. It has a high thermal conductivity (1.5/3.0 W/mK). ◆The thermal resistance value of the material itself is lower than that of acrylic-based materials, allowing for faster heat conduction. ◆Not only does it have minimal volatile substances due to heating, but it also has significantly fewer compared to acrylic-based materials. ◆Due to the use of high compressibility technology, the force required for compression is extremely small, and the wide heat dissipation area allows for faster heat conduction. ◆It has a double-sided mild adhesive property, excellent adhesion, and is convenient to work with. ◆Since mold shaping is done in-house, we can accommodate detailed specifications for sheet shapes, mold shaping, and cutting. ◆UL flame retardant and RoHS compliant. *For more details, please download the catalog or feel free to contact us.
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P4
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Asahi Ritsu proposes thermal solutions for lightweight, slim, and high-power modules. Our long-standing excellent research and development team quickly provides thermal solutions and can meet the special needs associated with customer product development.