We implement chip/lead components and BGA components using cutting-edge technology.
At Fujita Group, we provide implementation and quality tailored to our customers' needs, ranging from digital devices and automotive parts to robotic components, using new equipment and technologies. We respond to customer requests with ingenuity, whether it be for small lot or prototype implementation, special substrates, or large-sized substrate implementation. 【Equipment Available】 ■ SMT (Surface Mount Technology: 7 lines) ■ MIRTEC AOI (Visual Inspection: 7 units) ■ DIP (Automatic Soldering: 2 lines) *For more details, please refer to the external link page or feel free to contact us.
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Supporter of ODM and EMS fabless companies Fujita Manufacturing Co., Ltd. offers a one-stop solution for electronic device design, component procurement, assembly, and maintenance. We accommodate ultra-small size board mounting (0402) and provide low-cost solutions through overseas procurement, along with high-quality manufacturing through domestic production.