Case study of cutting processing for substrate alignment jigs! Achieved burr removal at a microscopic level from difficult-to-cut materials containing carbon, with a precision of ±0.02 and no burrs!
At Sepra, we perform plastic machining using high-rigidity machines that are typically used for metal cutting. We would like to request drilling a hole with a diameter of 100μm... we want an accuracy of 1/100mm... we require high precision but also have high demands for burr-free results... Is there anyone struggling with high-precision machining? For this machining request, we achieved an accuracy of ±0.02 without burrs using our equipment, and we were able to remove burrs at a microscopic level, resulting in great satisfaction. Material: Unilate CV 【Features】 ◆ It is possible to maintain the precision of pocket machining with carbon-filled difficult-to-cut materials! ◆ Burr removal at a microscopic level for base chips where burrs are strictly prohibited! ◆ We can assist with material selection for components! *For more details, please request our materials or view the PDF data available for download.
Inquire About This Product
basic information
【Equipment Owned】 ■ 5-axis machining center ■ Simultaneous 5-axis composite lathe ■ NC router ■ Other main equipment ■ 3D measuring instrument ■ Image dimension measuring instrument ■ Microscope *For more details, please download the PDF or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
Substrate and alignment jig
catalog（1）
Download All Catalogs
Company information
Sepla Corporation engages in engineering plastic processing, as well as electrical insulation material processing and model prototyping. We have advanced, high-spec equipment, including processing machines, software programs, and inspection devices. Additionally, we connect high quality, low cost, and short delivery times, and our clients are spread across the country, receiving high trust from major manufacturers.