Introducing a case study on the optimization of heat sink shapes, which is crucial for CPU heat dissipation measures!
We would like to introduce a case study on the shape optimization of heat sinks using our "modeFRONTIER." Optimizing the heat dissipation performance of heat sinks is crucial in addressing the heat generation issues of CPUs used in computers and other devices. With the multi-objective optimization of "modeFRONTIER," we can explicitly present a lineup of heat sinks with high heat dissipation performance, each suited to the diverse product shapes as Pareto solutions. [Case Study] ■ Software Used: modeFRONTIER ■ Objective: Heat management for CPUs used in computers and other devices ■ Challenge: Optimize the heat dissipation performance of heat sinks ■ Result: Using multi-objective optimization, we explicitly present a lineup of heat sinks with high heat dissipation performance suitable for diverse product shapes as Pareto solutions. *For more details, please refer to the external link or feel free to contact us.
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**Features of the Multi-Objective Robust Design Optimization Support Tool "modeFRONTIER"** - Equipped with advanced optimization methods, experimental design methods, and response surface approximation methods - Supports multi-objective robust design optimization and multi-objective tolerance design optimization - Includes a variety of post-processing functions such as statistical analysis, multivariate analysis, and CAP - Interface compatible with Japanese (Windows) and English environments - Standard dedicated nodes for direct access to various tools (such as CATIA V5, ANSYS Workbench, MATLAB, LabVIEW, etc.) *For more details, please refer to the external link or feel free to contact us.*
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For more details, please refer to the external link or feel free to contact us.
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While focusing on MBD and CAE technologies and their surrounding technical areas, we specialize in building virtual products and collaborative design processes through cutting-edge digital engineering. We have formed partnerships with leading software vendors of the era to provide top-level digital engineering technologies in Japan, including solutions for thermal fluid analysis, structural analysis, electromagnetic field analysis, acoustic analysis, system simulation, optimization technologies, embedded software development environments, and simulation process data management (SPDM) solutions. We offer a comprehensive engineering environment necessary to solve the diverse and complex challenges faced by our customers. Official Blog: https://www.idaj.co.jp/blog/ IDAJ YouTube Channel: https://www.youtube.com/channel/UCGCd8pB5Lwq_noIoxpgJrrw/featured X: https://twitter.com/IDAJ_CAE Facebook: https://www.facebook.com/IDAJ.CAE