By using a stabilization device before joining, even more reliable bonding is achieved!
The "UWS-J1000" is a system that achieves stable ultrasonic bonding even with multilayer foils. It monitors power waveforms during bonding and accurately determines the bonding condition (good or bad). Additionally, since bonding can be done with extremely low power, the lifespan of the horn and anvil is significantly extended. 【Features】 ■ Achieves stable ultrasonic bonding even with multilayer foils ■ Monitors power waveforms during bonding ■ Accurately determines the bonding condition (good or bad) ■ Allows bonding with extremely low power ■ Significantly extends the lifespan of the horn and anvil *For more details, please refer to the PDF document or feel free to contact us.
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JET Corporation handles semiconductor products and LIB products. To promptly respond to our customers' diverse needs, we continuously engage in research and development, and our manufacturing facility adopts a cell production system to accommodate individual orders one by one. For more details, please contact us.