If it's about BGA reballing, leave it to us! We will introduce the work process.
Our company performs "BGA Rework and Reballing" using 7 IPC-recommended IR rework devices. "BGA Reballing" refers to the process of regenerating the solder balls of a BGA. The process involves removing the BGA from the circuit board, removing the solder from the BGA, applying flux or solder paste, placing the solder balls, and then heating them with an IR heater to join the solder balls. You can trust us with your BGA reballing needs. We have a track record of reballing over 50,000 BGAs with ball diameters ranging from φ0.2 to 0.76mm. We assist in rescuing discarded circuit boards. Additionally, we also accommodate changes in solder composition (from eutectic solder balls to lead-free solder balls). 【Process】 ■ Removal: Remove the BGA from the circuit board ■ Cleaning: Remove the solder from the BGA ■ Solder Ball Placement: Apply flux or solder paste, then place the solder balls ■ Heating: Heat with an IR heater to join the solder balls *For more details, please refer to the PDF document or feel free to contact us.
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basic information
Our company has been committed to creating a more environmentally friendly world by prioritizing the global environment and engaging in activities such as circuit board modification, repair, BGA reballing, and component regeneration, even before the term SDGs became widely recognized. Feel free to entrust us with BGA with over 3000 pins. *For more details, please refer to the PDF materials or feel free to contact us.
Price information
Estimated labor costs for parts replacement (rework) BGA: 3,500 yen to 10,000 yen Module: 3,500 yen to 8,000 yen QFN: 2,500 yen to 6,000 yen FET: 800 yen to 2,500 yen QFP/SOP: 500 yen to 5,000 yen Estimated labor costs for BGA reballing Up to 5 units: 6,000 yen per unit 6 to 9 units: 5,000 yen per unit
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Applications/Examples of results
【Purpose】 ■BGA Reballing - I want to replace it for failure analysis. - I want to analyze it by exchanging it with a good product. - I want to implement it later because the device delivery time cannot be met. - Operational errors occur due to solder balls not being joined. - In such cases, please consider our BGA rework/reballing and QFN rework services. - We provide high quality through spot and uniform heating using IR radiation heating methods. - You can also trust us with LGA and BGA with over 3000 pins. *For more details, please refer to the PDF document or feel free to contact us.
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Company information
The impetus for our work on BGA rework was "environmental protection." Starting around 2002, we began to see a significant number of circuit board repairs that were impossible to fix while conducting mobile phone repair operations. When BGA (IC) was incorporated into mobile phones, adhesive (underfill) was used as a measure to prevent solder peeling. This adhesive reinforces the bonding between the circuit board and the IC, but due to aging and usage conditions such as drops, it can surprisingly crack easily. Later, these cracks can erode the solder of the IC, leading to functional failures. Since mobile phone circuit boards have many functions, the disposal cost for a single unit can be enormous. If IC replacement becomes possible, repairs can be conducted with just the cost of the IC and its replacement, allowing other components to be reused, which we believe connects this recycling technology to "environmental protection." Our company has been committed to creating a more environmentally friendly world through circuit board modification, repair, BGA reballing, and component regeneration long before the term SDGs became widely recognized, emphasizing the importance of the global environment.
