Alumina-based filler "High Thermal Conductivity Bemaite"

We propose bauxite, which has a high thermal conductivity equivalent to α-alumina, as a new thermal conductive filler.

The conventional bauxite has a low thermal conductivity, and its properties were not sufficient for heat dissipation applications. We have developed a high thermal conductivity type of bauxite with a thermal conductivity comparable to that of α-alumina using a special method. By filling it into plastics, rubber, sheets, greases, and other materials, it can impart high heat dissipation and thermal conductivity. Control over particle size (submicron to single micron) and particle shape (cubic, plate-like, flaky, needle-like, etc.) is possible. It can be used in various applications such as thermal conductive fillers, flame retardants, flame retardant aids, reinforcing materials, and abrasives. 【Features】 ■ High thermal conductivity comparable to α-alumina ■ Control over particle size (submicron to single micron) and particle shape (cubic, plate-like, flaky, needle-like, etc.) ■ High decomposition temperature (approximately 500°C) and excellent heat resistance ■ Low Mohs hardness (3.5 to 4) and small specific gravity (3.0 g/cm³) ■ Insoluble in acids and alkalis, demonstrating high chemical stability

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