Electronic component extraction processing service

We offer cutting types such as PAC-P (acrylic resin, etc.) and PAC-B (printed circuit boards, etc.)!

Our company specializes in precision die-cutting of electronic components. Focusing on flexible circuit boards, we also handle polarizers, diffusion films, panels, and more. In addition to conventional die-cutting, we can accommodate die-cut items that have been considered difficult with traditional Thomson-type methods, such as mounted circuit boards. Please feel free to contact us with your requests. 【Processing Examples】 ■ PAC-P (Acrylic Resin, etc.) PAT.P - Capable of die-cutting hard resins such as acrylic resin - Die-cutting possible for materials with thicknesses from 0.3 to 5 mm (shape to be discussed separately) - Excellent durability and workability due to the use of special blades ■ PAC-B (Mounted Circuit Boards, etc.) - Capable of collectively dividing single-sided, double-sided, FPC mounted circuit boards, perforated boards, and various other boards - Can accommodate all materials (phenolic, glass epoxy, etc.) and sizes/shapes *For more details, please download the PDF or feel free to contact us.

Printed Circuit BoardOther electronic partsProcessing Contract