Achieves stable low particle characteristics, eliminating the need for cleaning processes! Adheres closely to the uneven surfaces of the wafer circuit!
The "Back Grind Tape" is a tape that can protect the circuit surface during the grinding of the wafer's backside. Designed with an adhesive that does not require a cleaning process, it combines low particle generation and stable grindability. It has minimal changes in adhesive strength over time, ensuring stable release properties. 【Features】 ■ Excellent adhesion to the unevenness of the wafer circuit surface ■ Stable grindability during back grinding (low TTV) ■ Eliminates the need for a cleaning process by achieving stable low particle characteristics ■ Minimal changes in adhesive strength over time, ensuring stable release properties *For more details, please refer to the PDF document or feel free to contact us.
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【Lineup】 ■BGE-122S ■BGE-122V ■BGE-124S ■BGE-1250A3 ■P-Series *For more details, please refer to the PDF document or feel free to contact us.
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[Usage] ■Protection of the circuit surface during wafer backside grinding, etc. *For more details, please refer to the PDF document or feel free to contact us.
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Denka is a chemical company that operates in a wide range of fields, from inorganic and organic industrial materials to civil engineering and construction materials, electronic materials, food packaging materials, and pharmaceuticals. Founded on the business of manufacturing chemicals in electric furnaces, the company has developed high-temperature and firing control technologies, as well as nitriding technologies, and has applied them to organic synthesis and polymer processing to diversify its business. At the same time, to secure the energy that supports these operations, we have focused on constructing hydroelectric power plants and energy conservation. We are committed to sincerely addressing social issues and market needs, and we strive to respond faithfully to everyone's expectations, aiming to be a trusted manufacturing company for years to come.