Ideal for electronic components requiring heat dissipation! It has thermal conductivity and free moldability.
※Production ended in 2022. "TECACOMP TC" is a thermally conductive plastic that possesses thermal conductivity characteristics comparable to metal. It can be used in applications requiring thermal conductivity in environments where metal cannot be used. Depending on the type and amount of filler used, this product has a thermal conductivity of 1-25 W/m·K. It is suitable for electronic components that require heat dissipation. 【Features】 ■ Can be selected from a wide range of resins and thermally conductive fillers (such as PP, PEEK) ■ Excellent thermal conductivity: below 10 W/m·K is electrically insulating, above 25 W/m·K is conductive ■ Good moldability ■ Usable for LED, electrical and electronic, and automotive applications *For more details, please refer to the PDF materials or feel free to contact us.
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basic information
【Other Features】 ■ Cooling structures can be freely designed and molded. ■ Can be used as TIMs (Thermal Interface Materials) for chips requiring electrical insulation and heat dissipation. ■ Excellent cooling performance allows for the dispersion of heat without accumulating it, preventing damage to the chip. ■ Can be injection molded into free designs. *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
Company information
Enzinger Japan Co., Ltd. of the Enzinger Group manufactures and sells PEEK resin materials for machining, such as PEEK rods and PEEK sheets. In particular, PEEK sheets are highly regarded for having "extremely low internal stress" and "minimal warping, making it easy to achieve precise dimensions." The high technical expertise developed with PEEK is applied to the extrusion of crystalline resins such as nylon, PET, POM, and PP, providing machining-friendly resin materials. Additionally, we also offer machining materials for super engineering plastics such as polyimide, Ultem, and PPSU, in addition to PEEK.
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