We have accumulated unique processing know-how for grinding and mirror finishing of thin plate products.
Introducing Daisen Industrial Co., Ltd.'s "Thin Plate Grinding Processing with Minimal Warpage." We apply grinding technology that processes thin plates with a thickness of 1.0mm to achieve warpage of 5μm or less, accumulating unique processing know-how for grinding and mirror finishing of thin plate products. Leveraging these processing technologies, we also apply them to enhance the precision of thin plate processing, special cutting tools, unit bases, and slide ways. 【Features】 ■ Application of grinding technology that processes thin plates with a thickness of 1.0mm to achieve warpage of 5μm or less ■ Accumulation of unique processing know-how for grinding and mirror finishing of thin plate products ■ Application to enhance the precision of thin plate processing, special cutting tools, unit bases, and slide ways *For more details, please refer to the PDF document or feel free to contact us.
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Daiken Industrial Co., Ltd. is always considering a concept based on "monozukuri" (the art of manufacturing). We engage in fine processing that requires precision at the micron level. As technological innovation rapidly advances and the required level of technology rises, we at Daiken Industrial aim to realize both our corporate dreams and individual aspirations through the production of industrial products. This is rooted in the joy of "monozukuri," creating fulfillment and a rich life for each employee, while also contributing to the development of the company and the community. For this reason, we are filled with enthusiasm and a spirit of challenge, and our business development is always aggressive. Daiken Industrial, equipped with technology and an unwavering research spirit, accurately anticipates what the times demand and responds at the highest standards.