Precision processing of thin materials such as aluminum, non-ferrous metals, and plastic resins.
Our unique technology for "adhesive processing" offers high-precision cutting at 0.01mm increments! A substitute for laser processing. We have numerous achievements in various industries, including medical, food, and cosmetics!
Meiwa's unique technology "adhesive processing" is a new processing method that achieves precision of 【0.01mm units】 compared to laser processing, which has a precision of about 0.2mm. With numerous processes using clamps, it is possible to process many products in a single process! It also contributes to cost reduction and is adopted in various fields such as automotive, medical, food, and cosmetics. In particular, in the medical field, it is used in parts for ultrasound and DNA destruction devices. There are inquiries from various manufacturers in Europe as well as domestically. 【Features】 ■ Capable of processing multiple items simultaneously ■ Strong in aluminum, but can also process other materials ■ Produces minimal burrs, eliminating the need for subsequent processes ■ Active in inspection equipment in the medical field, among others *For more details, please contact us or download the PDF to view.
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General Chamfering Process In a typical chamfering process, a chamfer cutter is used. When using clamps for chamfering, the clamps can get in the way, resulting in two additional steps for changing the clamps. Even with a five-axis machining center, chamfering on the backside of the material is not possible, so the material needs to be flipped over. This requires two additional steps on the backside, leading to a total of four steps, which incurs labor costs for the changeover work. Additionally, there are concerns about quality due to human intervention, such as scratches or misalignment during the changeover.
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Meiwa's Unique Chamfering Process (Pascal Processing) 【What is Pascal Processing?】 Our unique Pascal processing method uses a custom Pascal cutter, allowing for chamfering on both the front and back surfaces in a single step (this applies only when the back surface requires chamfering). Of course, we can process multiple pieces simultaneously from a single table, so changing the workpieces can be done in one go for many products. Since everything is controlled by the machine's program in one step, we can ensure stable quality supply.
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Company information
Our company conducts various experiments with double-sided tape and uses a solvent that allows for easy peeling, contributing to many fields through our bonding processing and easy peeling technology. We are confident that this technology offers significant benefits to our customers, especially for thin and small items. We perform high-precision processing with a processing range of 1,050mm x 560mm and a processing accuracy of around 10 microns. Please feel free to contact us.
![[Factory and Equipment Introduction] We have introduced one 3D scanning measurement device.](https://image.mono.ipros.com/public/product/image/11f/2001176350/IPROS15948433281390235435.jpg?w=280&h=280)
![[Insulation Material Processing Example] Fineflex BIO Board Large Diameter Split](https://image.mono.ipros.com/public/product/image/2069787/IPROS9402177492004993539.png?w=280&h=280)