Specialized Book: Guidelines for the Design and Development of Components, Materials, and Devices for 5G Compatibility
What can be addressed from the perspective of material and component design in preparation for the upcoming 5G era? This explains the key points required during the design and development phase, along with examples from companies.
**Market Trends and Key Points to Watch for 5G-Related Services and Devices** ● What changes are occurring with the 5G transformation of base stations/smartphones, etc.? Trends in the market and direction towards practical implementation. **Key Technological Elements Crucial for the Expansion of 5G** ● "Consideration of Semiconductor Speedup": A key technology for 5G! Explanation of the thinning of connection circuits and encapsulation technology, which are important factors for speedup. 〇 "Massive MIMO": A key technology for communication systems! Technical challenges for hardware realization and proposals for specific configurations. ● "High-Speed Compatible FPC": Methods and material selection for high-speed transmission compatibility. 〇 "5G Antennas": Structure, design examples of millimeter-wave planar array antennas, and essential points for arraying. ● Concerns about smartphones in the 5G era: Required characteristics for enclosures and antenna materials, with a breakdown of two 5G-compatible products to explain design points! **Guidelines Required for 5G-Compatible Material Design, Development/Applications/Evaluation Methods** ● Types and characteristics of low-loss materials. Summary of major handling companies and price information. ○ Material characteristics required in high-frequency environments and the reasons for them, along with key points during design and development. **Approaches to Apply Existing Materials and Technologies to 5G** Development of curing agents, electromagnetic wave shielding coatings, high-strength dissimilar joining technologies, etc.
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Publication Date: September 17, 2019 Price: 50,000 yen + tax Format: B5 size, 213 pages ISBN: 978-4-86502-175-2 Chapter 1: Trends in New Technologies/Services and Material-Related Markets for 5G Chapter 2: Key Technological Elements for Expanding 5G Adoption ~Packaging Technology, Communication, Material Design, Compatible Devices Chapter 3: Design Techniques and Evaluation Methods for Millimeter Wave Absorbers and Electromagnetic Shielding Materials Required for 5G Chapter 4: Approaches to Utilize Existing Material Technologies for 5G Chapter 5: Evaluation Methods for Electrical Properties in High-Frequency Materials ~Dielectrics, Shielding Materials, Electromagnetic Absorbing Materials
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List price: 50,000 yen + tax
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List of Authors (Honorifics omitted) - Kotaro Fukushima (Kawasaki Techno Research Co., Ltd.) - Shigeru Koshibe (iPack Co., Ltd.) - Minso Kashio (Formalhaut Techno Solutions Inc.) - Kentaro Nishimori (Niigata University) - Fukuro Koshichi (Tokyo University of the Arts) - Hirofumi Matsumoto (Nippon Mectron Co., Ltd.) - Hiroyuki Fukunaga (Shinko Photo Service Co., Ltd.) - Kaoru Sudo (Murata Manufacturing Co., Ltd.) - Tomoya Hosoda (AGC Inc.) - Takushi Tasaki (Arakawa Chemical Industries Co., Ltd.) - Masayuki Hoden (Nitto Denko Corporation) - Takashi Yamamoto (National Defense Medical College) - Masao Tomikawa (Toray Industries, Inc.) - Kazuro Arita (DIC Corporation) - Takeshi Suga (Fujikura Kasei Co., Ltd.) - Yoshiko Nakamura (National Institute of Advanced Industrial Science and Technology) - Tetsuo Tsuchiya (National Institute of Advanced Industrial Science and Technology) - Yosuke Suzuki (Keycom Corporation)
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The information organization aims to contribute to the development of the industry through technical seminars on chemistry, pharmaceuticals, electronics, machinery, environment, cosmetics, food, etc., as well as the publication of technical books, correspondence courses, and DVDs that record seminars.