Polishing processing of various compound semiconductor crystals such as SiC, GaN, and GaP is possible!
At Japan Exceed, we perform polishing processing of various compound semiconductor crystals such as SiC, GaN, and GaP. We can also finish patterned compound wafers to a thin specification and accommodate delivery methods to our customers. Our company responds to polishing needs for various processing materials. 【Features】 ■ Polishing processing of various compound semiconductor crystals is possible ■ Can accommodate delivery methods to customers ■ Thickness: from 20μm ■ Surface roughness performance value GaP surface roughness: 0.1nm *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Compound Semiconductor Wafers (Excerpt)】 ■SiC ■GaN ■GaP ■GaAs ■Back processing of patterned wafers *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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EXCEED has the meaning of surpassing everything. Our company name, which carries that meaning, reflects our attitude and commitment to our work. We are constantly exploring polishing techniques that exceed limits and aspire to master the world of polishing. More flat, more smooth, more thin, more beautiful. New possibilities arise from polishing techniques that transcend various fields, as well as from our accumulated experience.