Introducing precision grinding of oxide materials, such as back processing of patterned wafers!
Nihon Exceed specializes in precision grinding and cleaning of oxide materials and other substances. Supported sizes range from Φ63mm to Φ150mm and 3mm×3mm to 100mm×100mm. Our company possesses the technology to thin the backside of patterned wafers to a specified Ra value through lapping (back lapping). 【Oxide Wafers】 ■Supported sizes: Φ63mm to Φ150mm, 3mm×3mm to 100mm×100mm ■Thickness: 20μm and above ■TTV: 5μm or less ■LTV (5mm×5mm): 0.4μm or less ■Surface roughness: 0.2nm or less ■Back surface roughness: 0.1μm to 4.0μm *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
EXCEED has the meaning of surpassing everything. Our company name, which carries that meaning, reflects our attitude and commitment to our work. We are constantly exploring polishing techniques that exceed limits and aspire to master the world of polishing. More flat, more smooth, more thin, more beautiful. New possibilities arise from polishing techniques that transcend various fields, as well as from our accumulated experience.