Introducing processing materials and technologies from Japan Exceed, such as Si wafers and metal materials!
This document introduces the processing materials and technologies of Japan Exceed. It includes special processing of Si using thinning processing technology, processing material "Si wafer," and micro shape evaluation technology using laser microscopy. Our company meets various polishing needs for processing materials. [Contents (excerpt)] ■ Special processing of Si ■ 6H-SiC single crystal (Si surface) ■ Metal materials and metal films ■ Micro shape evaluation technology using laser microscopy *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
【Published Processed Materials (Excerpt)】 ■ Si Wafers ■ Compound Semiconductor Wafers ■ Oxide Wafers ■ Metal Materials ■ Other Materials *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs![[Information] Introduction to Processed Materials & Technologies](https://image.mono.ipros.com/public/catalog/image/01/dab/481451/IPROS16207433408357248096.jpeg?w=120&h=170)
Company information
EXCEED has the meaning of surpassing everything. Our company name, which carries that meaning, reflects our attitude and commitment to our work. We are constantly exploring polishing techniques that exceed limits and aspire to master the world of polishing. More flat, more smooth, more thin, more beautiful. New possibilities arise from polishing techniques that transcend various fields, as well as from our accumulated experience.