8th Generation 6 Cores Xeon/Core i7/i5/i3 (Coffee Lake-S), fanless embedded PC
Features ■ Width 250.4 × Height 210 × Depth 131.4 mm (RCX-1200), 6.91 liters ■ 8th generation 6 core Xeon/Core i7/i5/Celeron CPU (Coffee Lake-S), fanless operation ■ DDR4-2666MHz (up to 128GB) ■ 4K resolution support, 3 independent display outputs ■ 4 or 2 PCIe/PCI expansion slots, 2 Mini PCIe ■ 4 2.5" HDD front access (RCX-14**-*R) ■ 2 GbE, 6 USB3.1, 4 COM, 32 DIO ■ Extended temperature support -40 to 75℃ (with 35W TDP CPU) ■ Wide DC input 6 to 36V ■ Control via ignition key (16 modes) ■ Railway standard EN50155 certified
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basic information
Specifications ■CPU: 8th Generation 6 Cores Xeon/Core i7/i5/i3 ■Chipset: C246 ■Memory: DDR4-2666MHz SO-DIMM x 4 (up to 128GB) ■Storage: 2.5" HDD/SSD x 4 SATA III (6Gbps), M.2 Key M x 1 ■Expansion Slots: Mini PCIe x 2, M.2 Key E x 1, PCI, PCIe ■I/O Connectors: GigE LAN x 2, USB3.1 x 6, USB2.0 x 1, RS-232/422/485 x 4, DVI-I x 1, DP x 1, Isolated DIO x 2, Audio Mic-in, Line-out ■Input Power: DC Input 6–36V ■Dimensions/Weight: RCX-1200: 250.4mm(W) x 210mm(H) x 131.4mm(L)/4.3kg ■Operating Temperature: -40–75℃ (35W TDP), -40–55℃ (65W TDP), -40–45℃ (80W TDP) ■Certifications: CE, FCC, EN50155, EN50121-3-2
Price information
Open price
Delivery Time
※The quantity and timing may vary, so please feel free to contact us.
Applications/Examples of results
Machine, factory, building automation/monitoring systems.
Line up（3）
| Model number | overview |
|---|---|
| RCX-1220A | 8th Gen CPU, PCIe[x8] x 2 |
| RCX-1220 | 8th Gen CPU, PCIe[x16] x 1, PCIe[x4] x 1 |
| RCX-1211 | 8th Gen CPU, PCIe[x16] x 1, PCI x 1 |
catalog（1）
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Company information
Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.