Microfabrication, thin film processing, trimming processing, micron level, SUS304.
Laser micromachining: thin film processing, trimming processing, micron level, SUS304
【Microfabrication, Thin Film Processing, Trimming Processing, Micron Level, SUS304】 【Material】 SUS304 【Material Dimensions】 Thickness: 0.1mm Remaining Width: 0.05mm 【Processing】 Ultrashort Pulse Laser Processing 【Features】 This product is a trimming process using SUS304 material. Fine processing is performed on a thin film with a thickness of 0.1mm and a remaining width of 0.05mm. This is an example of thin film processing unique to ultrashort pulse lasers. By using an ultrashort pulse laser, physical damage and thermal effects are significantly minimized, allowing for fine processing with minimal burrs. ◆ Fine processing of difficult-to-cut materials and complex shapes ◆ Automotive parts, medical device components, electronic components, semiconductor parts ◆ Prototype and development projects Leave it to us. Hikari Machinery Manufacturing Co., Ltd. ■ HIKARI LASER LAB. 511 Room, Higashikashi Techno Plaza, 5-4-6 Kashiwanoha, Kashiwa City, Chiba Prefecture, 277-0882 Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hikarikikai.co.jp/
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【Microfabrication, Thin Film Processing, Trimming Processing, Micron Level, SUS304】 【Material】 SUS304 (sus304) 【Material Dimensions】 Thickness: 0.1mm Remaining Width: 0.05mm 【Processing】 Ultrashort Pulse Laser Processing 【Features】 This product is a trimming process using SUS304 material. Microfabrication is performed on a thin film with a thickness of 0.1mm and a remaining width of 0.05mm. This is an example of thin film processing unique to ultrashort pulse lasers. By using ultrashort pulse lasers, physical damage and thermal effects are significantly minimized, enabling fine processing with minimal burrs. ◆ Microfabrication of difficult-to-cut materials and complex shapes ◆ Automotive parts, medical device components, electronic components, semiconductor parts ◆ Prototype and development projects Please leave it to us. Hikari Machinery Manufacturing Co., Ltd. ■ HIKARI LASER LAB. 511 Room, Tokatsu Techno Plaza, 5-4-6 Kashiwanoha, Kashiwa City, Chiba Prefecture 277-0882 Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hikarikikai.co.jp/
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【Microfabrication, Thin Film Processing, Trimming Processing, Micron Level, SUS304】 【Material】 SUS304 【Material Dimensions】 Thickness: 0.1mm Remaining Width: 0.05mm 【Processing】 Ultrashort Pulse Laser Processing 【Features】 This product features trimming processing of SUS304 material. Fine processing is performed on a thin film with a thickness of 0.1mm and a remaining width of 0.05mm. This is an example of thin film processing unique to ultrashort pulse lasers. By using ultrashort pulse lasers, physical damage and thermal effects are significantly minimized, allowing for fine processing with minimal burrs. ◆ Fine processing of difficult-to-cut materials and complex shapes ◆ Automotive parts, medical device parts, electronic components, semiconductor parts ◆ Prototype and development projects We are at your service. Hikari Machinery Manufacturing Co., Ltd. ■ HIKARI LASER LAB. 511 Room, Higashi-Kashi Techno Plaza, 5-4-6 Kashiwanoha, Kashiwa City, Chiba Prefecture 277-0882 Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hikarikikai.co.jp/
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At "HIKARI LASER LAB.", we offer services for precision processing using ultra-short pulse lasers, including "contract processing," "development agency," and "marking." Precision processing and surface modification/internal marking using picosecond and femtosecond lasers are utilized in various industrial equipment across sectors such as the medical industry, automotive industry, and semiconductor industry. Recently, there has been a demand for surface modification not only for shape processing like fine hole drilling, cutting, trimming, and groove processing but also for enhancing functionalities such as water repellency, release properties, friction reduction, and improved sliding properties. Additionally, there is a demand for marking inside glass from the medical industry. Laser processing is possible on a wide range of materials, including transparent materials like glass and diamonds, difficult-to-cut materials like titanium, and resins, CFRP, ceramics, and polyimides. Regarding surface modification, we have received requests to improve the release properties of molds. We will continue to "challenge" ourselves in precision processing and surface modification using ultra-short pulse lasers to meet our customers' needs!
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