Precision plating processes that support the semiconductor business.
Our company applies tin-based plating to the outer leads of semiconductor products, contributing to improved mounting strength and corrosion resistance on substrates. Additionally, we have established our own plating equipment (compatible with 300×100mm frames) to meet the diverse needs of our customers. 【Plating Equipment】 ■ Pure Sn exterior plating evaluation equipment (maximum 100×300mm) ■ Pure Sn exterior plating equipment (pure tin plating) ■ Sn-Ag exterior plating equipment (tin-silver plating) ■ Sn-Bi exterior plating equipment (tin-bismuth plating) ■ Sn-Pb exterior plating equipment (tin-lead plating), etc. *For more details, please download the PDF or feel free to contact us.
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【Device Specifications】 ■ Plating Type: Pure-Sn Plating ■ Applicable Frame: Frame length 200–300mm, Frame width 60–100mm ■ Transport Speed: MAX 3m/min (720F/H for 250mm frame) ■ Heating Method: Heater Heating ■ Loading Method: Manual Attachment, etc. *For more details, please download the PDF or feel free to contact us.
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Our company manufactures semiconductors for a wide range of applications, from consumer electronics such as televisions, audio devices, telephones, and cameras to industrial and automotive uses, tailored to our customers' needs. Additionally, we apply tin-based plating to the outer leads of semiconductor products, contributing to improved mounting strength and corrosion resistance on circuit boards. Please feel free to contact us if you have any requests.